NSF Scholarships in Science, Technology, Engineering, and Mathematics Program (S-STEM) Limited Submission – LOI Due in Kuali Build by December 12
Posted November 9, 2022
The NSF Scholarships in Science, Technology, Engineering, and Mathematics (S-STEM) program provides institutions of higher education (IHEs) with funds for scholarships to encourage and enable domestic low-income students with academic ability, talent or potential and demonstrated financial need to enter the US workforce following completion of associate, baccalaureate, or graduate degrees in S-STEM eligible disciplines. To enable social mobility of these students with academic talent, funds should be allocated to support scholars in areas of regional or national need. Funds also enable IHEs to establish a coherent ecosystem of effective evidence-based practices (curricular and co-curricular activities taking place during the academic year and over the summer and winter break months if appropriate) and to assess the effects of those practices and other factors on retention, student success, academic/career pathways, and degree attainment, including transfer, and entry into the US workforce or graduate programs in STEM.
Limit on Number of Proposals per Organization:
NSF limits the number of proposals submitted by an organization to the following: 2 proposals.
Due to the limit on the number of proposals per institution, interested SIUE applicants must apply to the internal competition by completing the Limited Submission form in Kuali Build by the Second Monday in December.
Winners of the internal competition will be notified of their authorization to submit a full proposal to the NSF by the second Monday January. Full proposals due to NSF on the third Monday of February.
All qualified candidates are encouraged to apply, including minorities, women, persons with disabilities, and protected veterans. Faculty with disabilities desiring accommodations in the application process should contact the Office of Equal Opportunity and Access at (618) 650-2333.
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