SIUE School of Engineering

High School Outreach 2008 – Summer Residential Program

June 8-11, 2008

*** Application deadline extended to Monday, May 12, 2008 ***

The goal of the High School Outreach Summer Program is to introduce various engineering disciplines, computer science and construction management to young aspiring high-school students through a set of activities that are fun, challenging, and thought-provoking.  Students will have the opportunity to learn about how engineering impacts our lives through participation in various hands-on laboratory experiments, design contests and field trips.  They will also get a flavor of residential college life, and will hopefully build lasting friendships with their peers from other high schools.

Eligibility

Current freshmen, sophomore and junior high school students interested in science, technology and engineering are encouraged to apply.

Housing

Accommodations will be provided in the residence halls of the university.  Participants will be assigned to double occupancy rooms; two rooms with shared bathroom facilities.

Meals

Each participant will be issued a university debit card to use for meals and snacks at the Morris University Center.

Supervision

Students will be supervised during all academic and recreational activities, including the overnight residence hall stay.

Insurance

All participants will be provided with limited Camper's Medical Benefit Coverage during the program. Coverage will provide benefits for necessary medical treatment of accidental injury up to the policy maximum.

Recreation

Participants will have access to evening recreational activities within the Vadalabene Center and University Center for a wide range of individual and group activities.

Awards Reception

An Awards Reception will be hosted for all participants on the afternoon of Wednesday, June 11, 2008. Family and friends are invited.

Group Pictures

A commemorative group photograph will be provided to each participant.

Program Cost

The fee for the High School Outreach program is $150, and includes accommodations, food, transportation to and from field trips, as well as all necessary materials and supplies.  A limited number of $100 scholarships are available for students who can demonstrate inability to pay the full cost of the program.

Application Procedure

Please download and print the online application form.  Completed application forms should be mailed to

Dr. Oktay Alkin
Associate Dean for Research and Development
SIUE School of Engineering
Campus Box 1801
Edwardsville, IL 62026-1801

The deadline for receipt of application forms is Monday, May 12, 2008.  Students selected for participation will be notified shortly after the cutoff date for applications.

Additional Information

For more information, please send email to oalkin@siue.edu.